SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor in which no crack is brought about to a glass pedestal when the glass pedestal is united to a metallic pipe. SOLUTION: A semiconductor pressure sensor chip 1 having a diaphragm 1a formed thin because of forming a recess part is united to a pedestal 2 having a through hole 2a formed for introducing a pressure to the diaphragm 1a. A metalized layer 8 is formed to a face of the pedestal 2 at the opposite side to a unite face to the semiconductor pressure sensor chip. The semiconductor pressure sensor is united by a solder to a metallic pipe 4 of a package via the metalized layer 8. In the sensor, a thin film 11 formed of the same material as the pedestal is formed on a unite face of the metallic pipe 4 to the pedestal 2 and, a metalized layer 8a of the same composition as the metalized layer 8 is formed on the thin film 11. The uniting by the solder is conducted between the metalized layers 8 and 8a.