| 摘要 |
PROBLEM TO BE SOLVED: To prevent displacement of lead plates by applying a convex adhesive on a insulative coating part at the tip of a pad part, contacting the tip to convex stoppers formed by hardening the adhesive, and by fixing the lead plates by solders formed on the pad. SOLUTION: Lead plates 160, 161 are soldered to both ends of a hybrid integrated circuit board 30. The surface of the hybrid integrated circuit board 30 is covered with an insulative coating film F for insulation, and as a result only the region in dashed line is exposed, and is formed as a pad part 165. Solder is printed on the pad part 165, to which the lead plate 161 is fixed by soldering and stoppers 166 for preventing displacement of the lead plate 160, are provided on the upper part. Slits 167 are formed in the lead plates 160, 161. When the lead plate 161 is added with upward displacement force at melting of the solder, the convex stoppers 166 prevent the lead plates 160, 161 from moving.
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