发明名称 MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To obtain laminated ceramic electronic components in which no short circuit occurs in a conductive layer and the breakdown strength characteristic of the layer does not deteriorate. SOLUTION: A method for manufacturing laminated ceramic electronic components includes a first step of forming a conductive layer pattern 2a having a desired shape on a form plate, a second step of transferring the pattern 2a to a transferring body, a third step of transferring the pattern 2a to ceramic green sheets 1a from the transferring body, a fourth step of forming a laminated body by laminating a plurality of ceramic green sheets 1a for carrying the pattern 1a upon another, and a fifth step of baking the laminated body. The conductive layer pattern 2a is heated before the third step, after the second step.
申请公布号 JP2000106317(A) 申请公布日期 2000.04.11
申请号 JP19980274944 申请日期 1998.09.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAGUCHI YOSHIYA;KURAMITSU HIDENORI;MIURA KATSUYUKI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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