发明名称 High density composite material
摘要 The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.
申请公布号 US6048379(A) 申请公布日期 2000.04.11
申请号 US19970884001 申请日期 1997.06.27
申请人 IDEAS TO MARKET, L.P. 发明人 BRAY, ALAN V.;MUSKOPF, BRIAN A.;DINGUS, MICHAEL L.
分类号 C08K13/04;C08K3/08;C08K7/02;C22C32/00;C22C47/14;C22C49/00;C22C49/10;C22C49/14;F42B12/74;G21F1/10;(IPC1-7):C22C27/04 主分类号 C08K13/04
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