SUBSTRATE THERMAL TREATMENT EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide substrate thermal treatment equipment, in which irregularities in heating treatment is not generated and purge gas can be introduced in a heat treatment space. SOLUTION: This substrate heat treatment equipment, which mounts a substrate W on a heating plate 10 in a chamber 11 and thermally treats the substrate, is provided with a cylindrical member 15, which is arranged so as to surround the heating plate 10 and is freely elevatable. A gas flowing path 18 jetting purge gas upwards is arranged outside the cylindrical member 15. An exhaust vent 19 for exhausting the purge gas is arranged in the central part of the upper surface of the chamber 11. Since the purge gas does not directly impinge against the surface of the substrate W during heating treatment, irregularities in heating treatment is not generated. Solvent component evaporated from the substrate W is attracted to the purge gas by negative pressure effect (ejector effect) to the flow of the purge gas and is exhausted smoothly.