| 摘要 |
PROBLEM TO BE SOLVED: To enable a wafer to be accurately delivered so as to be stably transferred coping with an increase in its size by a method, wherein a center-up member is composed of spoke-like mounts, and a radial through-parts in which the center-up member sinks down is provided to the mounting surface of a substrate holder. SOLUTION: Three through-parts 2A, 2B, and 2C are provided to the center of the mounting surface 1a of a substrate holder 1 which extend radially from its center and separated from each other by a central angle of 120 deg.. A center-up member 10 is composed of three spoke-like supports 11A, 11B, and 11C provided by monolithic molding or fastened to the top of a shaft 13, that penetrates through the center through-part of a substrate holder 1. The spoke-like supports 11A, 11B, and 11C extend rectilinearly in radial directions in an XY-plane separating from each other by a central angle of 120 deg. so as to sink sunk down into the through-parts 2A, 2B, and 2C in a non-contact manner. |
