| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting board which is lessened in cost and enhanced in mass-productivity, a manufacturing method and uses thereof. SOLUTION: A circuit pattern 1 is formed on the one surface 3a of an insulating board 3, and furthermore an insulator layer 5 is formed covering the circuit pattern 1. The insulating layer 5 is formed of insulating adhesive resin that is photosensitive and hot melt. A through-hole 6 is provided to the insulating layer 5 through an exposure and development process, and a contact conduction path 7a and a contact 7 are formed. A conductor layer 2 is formed on the other surface 3b of the insulating board 3. Furthermore, openings 4b are provided penetrating through the conductor layer 2 and the insulating board 3, the first circuit pattern 1 is exposed inside the openings 4b, and thus a mounting board can be obtained. Chips are mounted on the board, and the insulator layer functions as adhesive agent to seal up the active surfaces of the chips. |
