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发明名称
SOFT PACK PACKAGE AND DISPENSING SYSTEM FOR LIQUID PHOTOIMAGEABLE SOLDER MASK
摘要
申请公布号
EP0877709(A4)
申请公布日期
2000.04.05
申请号
EP19970901958
申请日期
1997.01.10
申请人
ENTHONE-OMI, INC.
发明人
MCCAGUE, ETHAN, J.;BURGESS, THIMOTHY, C.;FISCHER, CURTIS, A.;STONE, DAVID
分类号
B01F11/00;B01F13/00;B01F15/02;B65D30/22;B65D81/32;H05K3/00;H05K3/12;H05K3/28;(IPC1-7):B65D25/08;G03F7/16
主分类号
B01F11/00
代理机构
代理人
主权项
地址
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