发明名称 ABDECKSTREIFEN ZUM VERPACKEN VON ELEKTRONISCHEN BAUTEILEN
摘要 PCT No. PCT/JP96/03376 Sec. 371 Date May 21, 1998 Sec. 102(e) Date May 21, 1998 PCT Filed Nov. 18, 1996 PCT Pub. No. WO97/19140 PCT Pub. Date May 29, 1997For solving a problem of large dependency of peel-off strength upon sealing conditions, a problem of change of various properties with the lapse of time under storing circumstances, a delamination problem, an agglomerate problem and a transparency problem, there is provided a cover tape for packaging electronic components which has a stable peel-off strength and is composed of an outer layer consisting of a biaxially oriented film of any one of polyester, polypropylene and nylon; an intermediate layer consisting of a mixture comprising polyethylene as the main component; and a heat sealant layer consisting of a mixture of a thermoplastic resin and a filler.
申请公布号 DE69604083(T2) 申请公布日期 2000.04.06
申请号 DE1996604083T 申请日期 1996.11.18
申请人 SUMITOMO BAKELITE CO. LTD. 发明人 NAKANISHI, HISAO
分类号 B32B27/08;B65D73/02;B65D75/58;C09J7/02;(IPC1-7):C09J7/02 主分类号 B32B27/08
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