| 摘要 |
There is disclosed a composite material for an electronic part which has high thermal conductivity in a laminated direction, and also has low-thermal expansion characteristics. The composite material, used for a heat sink or a heat spreader, includes high-thermal conductivity layers of copper or a copper alloy and low-thermal expansion layers of a Fe-Ni alloy which are alternatively laminated to form a multi-layer structure having not less than 10 layers and preferably not less than 50 layers. Any two adjacent ones of the high-thermal conductivity layers, having the low-thermal expansion layer interposed therebetween, are continuous with each other through a plurality of through holes formed through the low-thermal expansion layer. This composite material can be produced by a method in which thin sheets of copper or a copper alloy and thin sheets of a Fe-Ni alloy (having a plurality of through holes) are alternatively stacked, and this stack is sealed in a vacuum not higher than 10-3 Torr, and the stack of layers is subjected to a bonding treatment at a temperature of 700 to 1,050 DEG C. under a pressure of not less than 50 MPa to provide a laminated structure, and this laminated structure is rolled into a sheet with a predetermined thickness.
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