发明名称 |
Apparatus for optical inspection of wafers during polishing |
摘要 |
An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafer's top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards.
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申请公布号 |
US6045433(A) |
申请公布日期 |
2000.04.04 |
申请号 |
US19950497382 |
申请日期 |
1995.06.29 |
申请人 |
NOVA MEASURING INSTRUMENTS, LTD. |
发明人 |
DVIR, ERAN;HAIMOVICH, ELI;SHULMAN, BENJAMIN |
分类号 |
B24B37/04;B24B49/12;H01L21/00;H01L21/304;H01L21/66;H01L21/683;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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