发明名称 |
Method of mounting a connection component on a semiconductor chip with adhesives |
摘要 |
A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
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申请公布号 |
US6045655(A) |
申请公布日期 |
2000.04.04 |
申请号 |
US19980170906 |
申请日期 |
1998.10.13 |
申请人 |
TESSERA, INC. |
发明人 |
DISTEFANO, THOMAS H.;KARAVAKIS, GUS;KOVAC, ZLATA;MITCHELL, CRAIG |
分类号 |
H01L21/48;H01L21/58;H01L21/60;H01L21/68;H01L23/495;H01L23/498;(IPC1-7):H05K1/14 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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