| 摘要 |
PROBLEM TO BE SOLVED: To realize to save resources and enhance an environment by eliminating solder plating and also enable to make inline a semiconductor device assembling step, by a method wherein a substantially recess part is provided on a lead mounting face and a projecting electrode part is provided in the substantially recess part. SOLUTION: With the use of a semiconductor element mounting part 1 and a lead frame in which a lead 2 is integrally formed with the same material, a semiconductor element 3 is secured and mounted to the semiconductor element mounting part 1 via an adhesive such as Ag paste, etc. The electrode pad of the semiconductor element 3 is connected to an inner end part 2a of the lead 2 with a bonding wire 4 such as gold, etc., thereby realizing an electric conduction. Furthermore, a plurality of lead mounting faces H is provided which are drawn outward from a resin-sealing part F sealed so as to contain such structural parts and are positioned on the same level with the bottom face of the resin-sealing part F. Then, a recess part 5 is provided on the lead mounting face H, and furthermore there is provided, in the recess part 5, a projecting electrode 6 is provided to which a conductive ball connected to an electrode of a mounting substrate is adhered and molten. |
