发明名称 TEMPERATURE ADJUSTING STRUCTURE FOR PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a temperature adjusting structure for printed board which can prevent the temperature drift of electronic parts, particularly, in a cold district and uses a smaller number of parts. SOLUTION: Since electronic parts 3 which are mounted on the printed board 1 of electronic equipment by reducing the number of parts can be maintained at a required temperature by sticking or printing a planar self-controlling positive temperature coefficient heating element 5 to or on the printed board 1 and energizing the heating element 5, the temperature drift of the parts 3 can be prevented, particularly, in a cold district. It is also possible to use a printed board composed of a planar self-controlling positive temperature coefficient heating element.
申请公布号 JP2000091714(A) 申请公布日期 2000.03.31
申请号 JP19980206970 申请日期 1998.07.22
申请人 SAKANO KAZUHITO 发明人 SAKANO KAZUHITO
分类号 H05B3/20;G05D23/19;H01L23/34;H05K1/02;H05K1/16;(IPC1-7):H05K1/02 主分类号 H05B3/20
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