发明名称 PANEL FOR HEATING AND COOLING FLOOR
摘要 PROBLEM TO BE SOLVED: To cope with various conditions in site by composing a panel for heating and cooling a floor of a main panel body where a pipe mat is buried overall, and a sub panel body that has a part where the pipe mat is buried and a part where the pipe mat is not buried. SOLUTION: A main panel body (m) is composed of a front plate 1 where decorating is made on a surface, and a back plate 2 consisting of plywood being applied to the back side of the front plate 1. A pipe mat (p) is buried between the front and back plates 1 and 2. By the pipe mat (p), a thin heat exchange pipe 5 being arranged with a fine pitch is connected between a pair of thick main pipes 3 and 4. Then, in a first sub panel body S1, the pipe mat (p) is buried at the left half part, and a non-heating region where the pipe mat (p) is not buried is provided at the right half part. On the other hand, in a second sub panel body S2, the pipe mat (p) is buried at the right half part that is at the opposite side of the first sub panel body S1, and a non-heating region where the pipe mat (p) is not buried is provided at the left half part.
申请公布号 JP2000088262(A) 申请公布日期 2000.03.31
申请号 JP19980282000 申请日期 1998.09.17
申请人 TOYOX CO LTD 发明人 SASAKI CHIKA
分类号 F24D3/16;(IPC1-7):F24D3/16 主分类号 F24D3/16
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