| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device by reducing the cutting of inner lead of the semiconductor device by using a film carrier and preventing the generation of the defective bonding connections in the semiconductor device which uses a film carrier. SOLUTION: By providing a notched parts 9 on the side part of each conductive pattern 4 of an aperture part, which constitutes a device hole 3 of a film carrier 1 and by forming the tongue-shaped part of the film carrier, having a conductive pattern and being pinched between the notched parts 9, is gradually deflected in the direction toward an inner lead 5, external stresses such as elongation, shrinkage, stretching and twisting caused by the change in the temperature generated after connection of the inner lead and a semiconductor chip is absorbed or relaxed.
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