发明名称 SUBSTRATE PROCESSING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a device which can enhance in-plane temperature uniformity of a substrate mounted on an upper face of a substrate pedestal without increasing thermal capacity of the substrate pedestal, and can shorten a time until the substrate pedestal reaches a set temperature when the set temperature is changed, and is superior in responsibility at the time of processing the substrate without causing an increase in size of a unit or an increase in consumption power. SOLUTION: An electrothermal heater 12 and a cooling Peltier element 16 are arranged at a lower face side of a substrate pedestal 10 in which a substrate W is mounted on its upper face, and a heat transfer chamber 20 closed airtightly is formed inside the substrate pedestal 10. A medium 22 to evaporate at a predetermined temperature is accommodated in the heat transfer chamber 20, and also a steam space 24 in which a steam of the medium convects is formed. A capillary member 26 for moving the medium from a bottom part of the heat transfer chamber 20 to a ceiling part thereof by a capillary phenomenon is arranged in the heat transfer chamber 20.</p>
申请公布号 JP2000091186(A) 申请公布日期 2000.03.31
申请号 JP19980252532 申请日期 1998.09.07
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 TSUJI MASAO
分类号 H01L21/683;H01L21/027;H01L21/324;H01L21/68;(IPC1-7):H01L21/027 主分类号 H01L21/683
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