| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which controls sticking particles to a wafer surface, dries a wafer surface rapidly without especially heating the wafer and uses only a little amount of organic solvent for drying when the wafer is washed with pure water and its surface is dried. SOLUTION: Rising water flow is formed by supplying pure water into a washing tank 12, pure water is made to overflow from an overflow part of an upper part thereof, a wafer is immersed and washed in pure water in a washing tank, the wafer is pulled up from pure water after washing, and vapor of water soluble organic solvent with a function to lower surface tension of pure water to the wafer is supplied to a circumference of the wafer together with inert gas while the wafer is pulled up from the pure water.
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