发明名称 SUBSTRATE FIXING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate fixing device, with which the fixing work of a small diameter on a ceramic substrate can be carried out easily and from which vacuum hardly leaks out. SOLUTION: A standard-diameter substrate 30 of a substrate fixing device, having the substrate 30 for holding a small-diameter substrate 20, has a plurality of linear grooves 32 formed on the surface of the substrate 30 which faces the substrate 20, a plurality of cross linear grooves 34 which are formed to intersect the grooves 32, and through-holes 36 formed at the intersections between the grooves 32 and 34. The small diameter substrate 20 is sucked to the standard diameter substrate 30 by evacuating via the through-holes 36.</p>
申请公布号 JP2000091407(A) 申请公布日期 2000.03.31
申请号 JP19980253744 申请日期 1998.09.08
申请人 YOKOGAWA ELECTRIC CORP 发明人 FUJITA TADASHIGE;SAKAKIBARA KATSUTOSHI;MIURA AKIRA;SANPEI YOSHIHIRO;AKASAKA KYOICHI;TOYODA HIROTAKA
分类号 H01L21/683;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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