发明名称 POWER SUPPLY FOR HIGH-SPEED CURRENT REVERSAL PLATING
摘要 PROBLEM TO BE SOLVED: To uniformly plate the object to be plated on a printed wiring board, by placing first and second auxiliary switching elements between the outputs of first and second reactors and the opposite-side output ends of first and second direct-current power supplies, respectively. SOLUTION: A first reactor 4A is placed between one end 2A1 of a first direct-current power supply 2A, and one end 2B2 of a second direct-current power supply 2B and a load 12, and a second reactor 4B is placed at the other end 2B1 of the second direct-current power supply 2B, the other end 2A2 of the first direct-current power supply 2A and the load 12. A first auxiliary switching element 10A is placed at the output end of the first reactor 4A and the other end 2A2 of the first direct-current power supply 2A. In addition, a second auxiliary switching element 10B is placed between the output end of the second reactor 4B and the one end 2B2 of the second direct-current power supply 2B.
申请公布号 JP2000092841(A) 申请公布日期 2000.03.31
申请号 JP19980281954 申请日期 1998.09.17
申请人 SANSHA ELECTRIC MFG CO LTD 发明人 NISHIO TAKASHI;ARAI TORU;ISHII HIDEO
分类号 H05K3/18;C25D5/18;H02M3/155;H02M7/00;H02M7/12;(IPC1-7):H02M7/00 主分类号 H05K3/18
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