发明名称 RELEASE AGENT COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a release agent compsn. for resist capable of easilily releasing even a resist deformed by high energy treatment a short time and reduced in the corrosion of a metallic member such as a wiring material. SOLUTION: This compsn. for the resist is prepared by compounding a compd. having a lactone ring and hydroxy groups in the molecule, an org. polar solvent and water. Or, the compsn. is prepared to contain a compd. having a lactone ring and hydroxy groups in the molecule, an org. polar solvent and water. In this compsn., the org. polar solvent is preferably one or more kinds selected from dimethyl formamide, N-methyl-2-pyrrolidone, dimethyl imidazolidinone, dimethyl sulfoxide and compds. expressed by the formula of R1(X)(AO)nR2. In the formula, R1 is a hydrogen atom or 1-12C hydrocarbon group, X is -O-, -COO-, -NH- or -N((AO)nH)-, m and n are 1 to 20, A is a 2-3C alkylene group, R2 is hydrogen atom or 1-8C hydrocarbon group.
申请公布号 JP2000089480(A) 申请公布日期 2000.03.31
申请号 JP19980255695 申请日期 1998.09.09
申请人 KAO CORP 发明人 KITAZAWA KOZO;KASHIHARA EIJI;SHIROTA MASAMI
分类号 H01L21/027;G03F7/42;(IPC1-7):G03F7/42 主分类号 H01L21/027
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