| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting density on a circuit substrate by a method, wherein a die pad provided with a plurality of suspended leads is electrically independently disposed at a substantially center part of a plane, the part of a projection part having an external terminal configuration provided on the reverse face is exposed to the outside, and a semiconductor element is mounted on a die pad surface by electrically insulating each other. SOLUTION: A die pad is electrically disposed independently at a substantially the center part of a plane, where a terminal part 4 is two-dimensionally disposed. A suspension lead 7 is electrically extended independently from four corners of the die pad, and a projection part 8 having an external terminal configuration is provided on the reverse face of the suspension lead 7. A face of the projection part 8 having an external terminal configuration is configured as the same face as the face of an external terminal 4B of the terminal part 4. Next, each terminal 52a of a semiconductor element 52 mounted on the die pad is connected to an internal terminal 4A (a silver-plated layer 5) of the terminal part 4 with a bonding wire 54. Then, the terminal part 4, the die pad, the suspension lead 7, the semiconductor element 52, and the bonding wire 54 are sealed with a sealing member 55, so that a part of the external terminal 4B and the projection part 8 having external terminal configuration is exposed.
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