发明名称 |
Power module substrate, method of producing the same, and semiconductor device including the substrate |
摘要 |
<p>A power module substrate includes a ceramic substrate having a circuit pattern formed thereon, and a metal frame with which the ceramic substrate can be joined to a water-cooling type heat sink. The metal frame has a thickness equal to that of the ceramic substrate or the ceramic substrate having the circuit pattern, and is provided with plural perforations formed therein. Metal thin sheets having through-holes in communication with the corresponding perforations, and containing contacting portions having the undersides thereof contacted to at least a part of the circumferential surface of the ceramic substrate are disposed on the surface of the metal frame. In a semiconductor device, a semiconductor element is mounted onto the circuit pattern, and the power module substrate is joined directly to the water-cooling type heat sink by inserting male screws through the through-holes and the perforations, and screwing the male screws in the female screws of the water-cooling type heat sink. <IMAGE></p> |
申请公布号 |
EP0989606(A2) |
申请公布日期 |
2000.03.29 |
申请号 |
EP19990118655 |
申请日期 |
1999.09.22 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
NAGASE, TOSHIYUKI;NAGATOMO, YOSHIYUKI;KUBO, KAZUAKI;SHIMAMURA, SHOICHI;GOSHI, KOICHI |
分类号 |
H01L23/24;H01L23/40;H01L23/473;H01L25/07;H01L25/18;(IPC1-7):H01L23/40 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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