| 摘要 |
PROBLEM TO BE SOLVED: To simply obtain a meleimide-based resin having a specific structure, having excellent flexibility, heat resistance, mechanical strength, etc., and useful for flexible printed circuit boards, etc., by mixing a specific maleic anhydride analogue powder with a specified diamine powder in equimolar amounts and subsequently thermally treating the mixture in the solid state at a specific temperature. SOLUTION: This method for producing the maleimide-based resin having repeating units each having a structure of formula II (R3 is a >=2C aliphatic group, an alicyclic group, a monocyclic aromatic group, etc.,) comprises mixing the powder of a maleic anhydride analogue of formula I (R1, R2 are each H, an alkyl or the like)(preferably maleic anhydride powder) with the powder of a diamine (preferably 4,4-diaminodiphenylmethane powder) in a molar ratio of 1:1 in a solid state, and then thermally treating the mixture in the solid state at 80-200 deg.C preferably for 1 min to 30 hr. The obtained resin is soluble in solvents, and the solution of the obtained resin can easily be used to produce films at low costs.
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