发明名称 EMI containment for microprocessor core mounted on a card using surface mounted clips
摘要 An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.
申请公布号 US6043983(A) 申请公布日期 2000.03.28
申请号 US19980098819 申请日期 1998.06.17
申请人 INTEL CORPORATION 发明人 TAYLOR, SCOT W.;STARKSTON, ROBERT;GEALER, CHARLES;RUTIGLIANO, MICHAEL L.;KRICK, RAYMOND A.;RABENIUS, JOHN A.;HART, EDMOND L.;MAHAJAN, RAVI V.;FARES, FARUKH
分类号 H05K9/00;(IPC1-7):H05K7/20 主分类号 H05K9/00
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