EMI containment for microprocessor core mounted on a card using surface mounted clips
摘要
An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.
申请公布号
US6043983(A)
申请公布日期
2000.03.28
申请号
US19980098819
申请日期
1998.06.17
申请人
INTEL CORPORATION
发明人
TAYLOR, SCOT W.;STARKSTON, ROBERT;GEALER, CHARLES;RUTIGLIANO, MICHAEL L.;KRICK, RAYMOND A.;RABENIUS, JOHN A.;HART, EDMOND L.;MAHAJAN, RAVI V.;FARES, FARUKH