发明名称 |
Method and device for cutting and mirror finishing single crystal silicon carbide |
摘要 |
The present invention comprises: a metal bond grind stone having a flat plate portion 10a and a tapered portion 10b; an electrode 13 opposed to the metal bond grind stone with a gap therebetween; voltage applying means 12 for applying a direct-current pulse voltage between the metal bond grind stone and the electrode; conductive liquid supplying means 14 for supplying a conductive liquid 15 between the metal bond grind stone and the electrode; and grind stone moving means 16 for moving the metal bond grind stone in a direction orthogonal to the shaft center thereof, and an ingot 1 of a single crystal SiC is thereby cut at the tapered portion 10b of the metal bond grind stone and the cut surface is then specular-worked at the flat plate portion 10a. <IMAGE> |
申请公布号 |
AU5446799(A) |
申请公布日期 |
2000.03.27 |
申请号 |
AU19990054467 |
申请日期 |
1999.09.01 |
申请人 |
RIKEN;SHOWA DENKO K K |
发明人 |
HITOSHI OHMORI;YUTAKA YAMAGATA;NOBUHIDE ITOH;NOBUYUKI NAGATO;KOTARO YANO;NAOKI OYANAGI |
分类号 |
B24B7/22;B24B27/06;B24B53/00;B24D5/12;B28D5/02 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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