| 摘要 |
PURPOSE: An integrated circuit chip package is provided to conduct an excellent electric function and an electric connection of a high density for an integrated circuit chip. CONSTITUTION: The integrated circuit chip package comprises: a retaining body (37); an integrated circuit chip (34) having a front plane and a rear plane, wherein the rear plane of the chip is attached to an internal dome; contacts (30) formed on die pads on the front plane through a photo-lithography process, wherein each of the contacts includes a portion perpendicularly formed on the die pad, a horizontal portion having one end formed at the portion, and a contact portion perpendicularly formed on the other end of the horizontal portion; and a capsulation material (38) provided on the front plane of the integrated circuit chip for sealing the integrated circuit chip. |
