发明名称 MANUFACTURE OF CATHODE SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To enhance an electron emission performance without impairing an electrode substrate surface by coating one surface of a metal sintered body thin plate with a brazing filler metal, irradiating it with a laser to generate burrs on a surface on which the brazing filler metal is not applied, cutting it off, removing the burrs and impregnating it with an electron emission substance. SOLUTION: A brazing filler metal comprising a ruthenium-molybdenum alloy is applied on one surface of a porous tungsten thin plate 12 and is dried. The thin plate is heated in a reducing atmosphere to form a ruthenium-molybdenum alloy layer 13. When a cathode substrate is cut off by irradiating it with a laser, a burr does not generate on a surface on which the brazing filler metal comprising a strong alloy layer 13 is applied and fragile burrs B of a metal sintered body is generated only on the thin body 12 side. Accordingly, the burrs B can be removed without crushing an opening of a hole on a cathode surface and a reduction of the electron emission performance can be prevented. An electron emission substance 14 comprising barium oxide is laded on the tungsten-exposed surface side of the thin plate 12 and the substance 14 melts in the hole of the cathode substrate in a reducing atmosphere to perform impregnation.</p>
申请公布号 JP2000082396(A) 申请公布日期 2000.03.21
申请号 JP19980252679 申请日期 1998.09.07
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 HARA AKITO;MURO NAOTO
分类号 H01J1/28;H01J9/04;(IPC1-7):H01J9/04 主分类号 H01J1/28
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