| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the adaptation to the automation of a semiconductor production line by providing a carrying means for exchanging a sample among a cassette, a carry-in chamber, and a carry-out chamber in a space being surrounded by a U-shaped vacuum chamber. SOLUTION: A wafer 10 in a cassette 1a is pulled out by a transfer device 7 and is carried into a load lock chamber 3 through an isolation valve 6a. The isolation valve 6a in the load lock chamber 3 is closed, vacuum evacuation is made, an isolation valve 6b is opened, and the wafer 10 is carried into an etching chamber 5 for performing etching treatment. In the meantime, the pressure in the load lock chamber 3 is returned to atmospheric pressure while the isolation valves 6a and 6b are closed, the isolation valve 6a is opened, and a second wafer is carried in for evacuation. The first wafer 10 is carried to an unload lock chamber 4 by opening an isolation valve 6c after etching is completed, the pressure is returned to atmospheric pressure, and the wafer 10 is returned into a cassette 1a through an isolation valve 6d. The isolation valve 6c is closed, the second wafer is carried in, and the similar treatment as the first treatment is made. |
