发明名称 |
Method and apparatus for detecting process sensitivity to integrated circuit layout using wafer to wafer defect inspection device |
摘要 |
A method and apparatus for detecting random layout structures sensitive to process induced pattern errors in semiconductor device manufacturing applies a first manufacturing process to a first wafer containing semiconductor devices. A second manufacturing process is applied to a second wafer containing semiconductor devices. The second manufacturing process is similar to, but different from the first manufacturing process. The first and second wafers are compared by image subtraction to detect systematic pattern defects in the semiconductor devices of one of the first and second wafers. After differences are detected, the layout is examined to determine whether the difference represents a defect. If so, the design rules of the layout can be changed to accommodate a wider process variation and improve processing yield.
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申请公布号 |
US6040912(A) |
申请公布日期 |
2000.03.21 |
申请号 |
US19980163314 |
申请日期 |
1998.09.30 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
ZIKA, STEVEN J.;HOPPER, C. BRADFORD |
分类号 |
G01N21/956;(IPC1-7):G01B11/00 |
主分类号 |
G01N21/956 |
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