| 摘要 |
PROBLEM TO BE SOLVED: To prevent an adhesion of a moving part to a fixed electrode or a semiconductor substrate caused by static electricity or the like generated during manufacturing process of a semiconductor acceleration sensor through formation of a beam structural moving part and a fixed part on a semiconductor substrate. SOLUTION: Electrode pads 44a and 44c electrically connected to a fixed electrode, an electrode pad 44b electrically connected to a moving part, an electrode pad 44d for taking out electric potential of a thin film for bonding and an electrode pad 43 for taking out surface electric potential on a semiconductor substrate are respectively connected by connecting wires 100, and the connecting wirings 100 are cut off after sensor manufacturing.
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