发明名称 THERMOSETTING RESIN COMPOSITION FOR RESIN-COATED SAND FOR MOLD
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition capable of remarkably controlling the generation of formaldehyde during or after molding works and useful for producing molds, etc., by mixing a thermosetting resin with a specific compound. SOLUTION: This thermosetting resin composition for resin-coated sand used for producing molds is obtained by mixing (A) a thermosetting resin containing formaldehyde with (B) at least one compound selected from a compound of formula I [X is O or S; R1-R4 are each H, a 1-8C (substituted) alkyl, a 3-8C (substituted) cycloalkyl or the like] and a compound of formula II [R5-R9 are each H, a 1-8C (substituted) alkyl, a 3-8C (substituted) cycloalkyl or the like] in an amount of 0.1-10 wt.% based on the component A. The component B includes a hydrazo compound such as hydrazodicarbonamide.
申请公布号 JP2000080246(A) 申请公布日期 2000.03.21
申请号 JP19980249660 申请日期 1998.09.03
申请人 OTSUKA CHEM CO LTD 发明人 TOMOTAKI YOSHIHISA;KAMIYA KAZUSAKI;ABE YOSHINOBU
分类号 C08K5/24;B22C1/22;C08K5/36;C08L61/00;(IPC1-7):C08L61/00 主分类号 C08K5/24
代理机构 代理人
主权项
地址