| 摘要 |
PROBLEM TO BE SOLVED: To provide a temporary bond for an electronic part and a method for soldering an electronic part which allows sure soldering with no self- alignment of an electronic part obstructed. SOLUTION: A square chip 4 is mounted on a cream solder 3 applied on a circuit pattern 2 of a substrate, and then heated. Although the cream solder 3 melts, the viscosity of a temporary bond 7 is lower than a room temperature in the molten state, so the self-alignment of the square chip 4 is performed with sure, and displacement of the square chip 4 is corrected. If the substrate is further heated, the temporary bond 7 solidifies so that the square chip 4 is temporarily bonded to the substrate. Then, the molten solder is cooled to be solidified for completing soldering.
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