发明名称 LAPPING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a lapping material formed in a thin thickness state within 1 mm thickness to be suited for fine lapping process in polishing or the like of a rib groove in an electric discharge machining surface of a metal mold, in the lapping material of stick shape arranging an inorganic long fiber and abrasive grains as a polishing element in a resin matrix. SOLUTION: This lapping material is a thin thickness stick-shaped lapping material arranging an inorganic long fiber 1 as a polishing element in a resin matrix 2 to be formed within 1 mm thickness, an inorganic long fiber of 100 Gpa or more elastic modulus is used as the inorganic long fiber, also 5 to 20 wt.% abrasive grains are contained in the matrix 2, and this constitution is provided with 450 Mpa or more bending strength and 30 Gpa or more bending elastic modulus.
申请公布号 JP2000079567(A) 申请公布日期 2000.03.21
申请号 JP19980264012 申请日期 1998.09.01
申请人 TAIMEI CHEMICALS CO LTD;XEBEC TECHNOLOGY:KK 发明人 MIYAZAWA TAKUMA;SUMIYOSHI TAKEHIKO
分类号 B24D3/00;B24D3/28;B24D7/18;(IPC1-7):B24D3/28 主分类号 B24D3/00
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