ADHESION APPARATUS OF CIRCUIT TAPE AND WAFER FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An adhesion apparatus of circuit and wafer is provided to stick a circuit tape, where adhesive tape adhered, on the wafer where a number of semiconductor chips are formed at an exact standard position. CONSTITUTION: An adhesion apparatus of circuit and wafer comprises: a sucking part(10) sucking the circuit tape where adhesive tape is stuck to the bottom and sticking the circuit tape on the wafer; a suction moving part(20) being located at the upper part of the suction part(10) and moving the suction part(10) toward the up and down directions; a die part(30) being located at the lower part of the suction part(10), on which the wafer is settled; a die X, Y, theta moving part(40) being located at the lower part of the die part and moving the die part(30) in the X, Y direction and in a theta angle; a camera part(50) being located between the suction part(10) and the die part(30), scanning and comparing the standard position of the circuit tape and the wafer; a camera moving part(60) being located at the upper part of the camera part(50) and moving the camera in the front and back direction.