发明名称 CONNECTOR FOR BINDING TOGETHER OF SEMICONDUCTOR MEASURE EQUIPMENT
摘要 PURPOSE: A connector for binding together of semiconductor measure equipment is provided to bind via connector so that a wire separating work is easily accomplished. CONSTITUTION: A connector for binding together of semiconductor measure equipment includes a plug(32). A socket(34) is formed in the plug. A pin(30) is inserted in the socket so as to, one to one, correspond to two or more wires(16, 24). An one end of the two or more wires is combined to an assembly(10), which consists a predetermined apparatus, by a screw(12, 22). An other end of the two or more wires is combined to the pin which is inserted in a cap(28) of a housing type insulated each other.
申请公布号 KR20000015650(A) 申请公布日期 2000.03.15
申请号 KR19980035686 申请日期 1998.08.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOO, IN-SEOP
分类号 H01R13/629;(IPC1-7):H01R13/629 主分类号 H01R13/629
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