摘要 |
PURPOSE: A connector for binding together of semiconductor measure equipment is provided to bind via connector so that a wire separating work is easily accomplished. CONSTITUTION: A connector for binding together of semiconductor measure equipment includes a plug(32). A socket(34) is formed in the plug. A pin(30) is inserted in the socket so as to, one to one, correspond to two or more wires(16, 24). An one end of the two or more wires is combined to an assembly(10), which consists a predetermined apparatus, by a screw(12, 22). An other end of the two or more wires is combined to the pin which is inserted in a cap(28) of a housing type insulated each other.
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