发明名称 |
RADIO FREQUENCY POWER AMPLIFICATION MODULE |
摘要 |
A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the printed circuit board; and a cap. The radiation section includes a plurality of radiation boards, the plurality of radiation boards at least including a first radiation board as a lowermost layer, and a second radiation board attached onto the first radiation board, the first radiation board being coupled to the cap. |
申请公布号 |
KR100246654(B1) |
申请公布日期 |
2000.03.15 |
申请号 |
KR19970008122 |
申请日期 |
1997.03.06 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NAKAMURA, MORIO;MAEDA, MASAHIRO |
分类号 |
H01L23/367;H05K7/20;H05K9/00;(IPC1-7):H03F3/00 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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