| 摘要 |
In a production method for an insulated semiconductor device of the invention, before die bonding, leads of a flat hoop frame are shaped so that outer lead portions may be positioned at predetermined positions with respect to an outer profile of a semiconductor device after a resin is filled. To this end, a lead shaping apparatus (6) for shaping inner lead portions (3) of a flat hoop frame (1) supplied thereto from a frame supply apparatus (4) is located between the frame supply apparatus (4) and a die bonding apparatus (5) so that, before die bonding of semiconductor pellets (11) is performed, shaping of the inner lead portions (3) is performed. Thereafter, die bonding and wire bonding are performed for the flat hoop frame (1), and then, resin is filled only into a lower metallic mold cavity (16) by a resin filling apparatus (13) to embed the inner lead portions in the resin. <IMAGE> |
