APPARATUS FOR BONDING ELECTRONIC COMPONENTS

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for bonding electronic components which can prevent the temperature of a bonding tool from increasing and suppress the change of vibration characteristics. SOLUTION: An apparatus which bonds electronic components by imparting vibration to them while pressing an electronic component 30 against a substrate 30, which is heated and held by a substrate holding table 33, is provided with a covering member 41 which shields a horn 20b and a vibrator 21 of a bonding tool 20 from the radiant heat from the substrate holding table 33 by covering them. Furthermore, air is supplied into the covering member 41 to cool the born 20b and the vibrator 21. This allows for the change in vibrational characteristics due to increasing temperature of the vibrator 21 to be suppressed and the vibration transferred to the electronic component 30 to be prevented from damping to stabilize the quality of bonding.