POLISHING SYSTEM FOR SEMICONDUCTOR WAFER AND RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To make uniform polishing amount in the plane of a semiconductor wafer by controlling a platen drive means and a head drive means such that the temperatures at two points of the semiconductor wafer become equal. SOLUTION: Based on a central part temperature detection signal S1 and an outer circumferential part temperature detection signal S2, a control section 10 controls the r.p.m. ΩH of the head such that the temperature distribution in the plane of a semiconductor wafer 5 is uniform. Polishing amount (temperature) in the plane of the semiconductor wafer 5 is made uniform by taking advantage of the characteristics that the temperature distribution in the radial direction of the semiconductor wafer 5 varies in correspondence with the variation in the ratio of r.p.m. ΩH of the head to r.p.m. ΩP of the platen. More specifically, the polishing amount (temperature) in the plane of the semiconductor wafer 5 is made uniform by controlling the r.p.m. ΩH of the head to obtain a relative speed distribution of reverse characteristics.