| 摘要 |
PROBLEM TO BE SOLVED: To enable an effective solder ball suction hole pattern of a mounting head to be easily changeable by a method, wherein a mask that covers solder ball suction holes which are provided in the mounting head and where solder balls are not required to be fed is prepared for the mounting head, and the mask is used as necessary. SOLUTION: A mounting head 4 is set movable in the vertical direction and reciprocated between a solder ball feed unit 3 and a mounting stage 13 by a drive mechanism, and a suction plate 11 where solder ball suction holes 19 are arranged in a matrix, corresponding to the wiring pattern of a chip, is attached to the underside of the mounting head 4. Suction holes 20 existing in suction holes 10 where no solder balls are mounted are covered with a mask A, whereby unnecessary solder balls 9 are prevented from being sucked by suction holes. Then solder balls are mounted on a wafer using the required number of masks as needed.
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