| 摘要 |
PROBLEM TO BE SOLVED: To dice a semiconductor wafer into individual semiconductor chips accurately. SOLUTION: A semiconductor wafer 11 is adhered on uncured UV curable sheet 12 as shown in (1). The sheet is cured by irradiating UV as shown in (2). Since the UV curable sheet 12 is cured, full dicing is performed to cut the wafer together with the UV curable sheet when dicing the wafer with a dicing blade 13 as shown in (3). Therefore, the wafer can be accurately diced so that the side surfaces of separated light-emitting diode chips 14 are flat and perpendicular to the pn junction. When a number of light-emitting diode chips 14 are mounted on a printed wiring board, etc., by placing chips laterally, the pn junction is perpendicular to the substrate surface, which results in uniform luminous intensity.
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