| 摘要 |
PROBLEM TO BE SOLVED: To make high-density electric mutual connection and packaging that are used for an IC chip with high speed and a high band implementable, and make easily connectable to or disconnectable from a printed board. SOLUTION: The IC package comprises an enclosure 37 with a high thermal conductivity that is constituted of an insulation material, an integrated circuit chip with a front and rear faces whose rear face is bonded to the top of the inside of the enclosure 37 through an adhesive 35, and a plurality of contacts 30 formed on a die-pad 32 on the front face of the integrated circuit by a photolithography treatment process, where each contact 30 is constituted with a base part vertically formed on the die-pad 32, a lateral part whose end is formed at the base part, the contact 30 having a contact part vertically formed at other end of the lateral part, and an encapsulant 38 placed on the front face of the integrated circuit for air-tightness sealing. In the IC package, a plurality of contacts 30 are projected through the encapsulant 38, where the lateral part of each contact 30 generates contact force when the contact 30 is pressed by a contact target. |
