| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic components where variations in manufacturing an improved by increasing the etching machining accuracy of a thin pattern. SOLUTION: In a manufacturing method, a mask for etching that consists of a plurality of patterns with a different pattern width and a different pattern gap is used for etching a semiconductor substrate. In this case, the mask where dummy patterns 8a and 8b for adjusting the etching time in a depth direction are provided, at least, at one side of a beam pattern 2e with a narrow width is used for etching.
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