发明名称 |
Wiping contacts |
摘要 |
Throughput and accuracy of testing of a semiconductor device is improved by forming the contacts to allow the leads of a packaged semiconductor device to pass through the contacts. Both AC and DC testing may be done because the contact length is substantially shortened.
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申请公布号 |
US6037789(A) |
申请公布日期 |
2000.03.14 |
申请号 |
US19920969541 |
申请日期 |
1992.10.30 |
申请人 |
MOTOROLA, INC. |
发明人 |
FRISBIE, MILO W.;SWAPP, MAVIN C. |
分类号 |
G01R1/04;H04L25/02;(IPC1-7):G01R1/073 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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