| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for treating a substrate, whereby consumption of a treating liq. used for treating the substrate can be minimized as much as possible. SOLUTION: In the required treatments for a substrate being spun, while feeding it with a treating solution (e.g. pure water as a cleaning solution), the treating solution is intermittently fed to the substrate. An 'old' treating solution (esp., the treating solution in a lower layer) that has deteriorated in treatment effect on the substrate is scattered off, due to spinning of the substrate while feeding of the treating solution is temporarily interrupted. Then feeding of the treating solution is resumed to make a fresh treating solution act on the substrate surface, thereby enhancing the treating effect of the substrate. The consumption of the treating solution is suppressed by a fraction of this solution, corresponding to the time solution of the interrupt of the feeding thereof. |
