METHOD FOR MANUFACTURING A CHIP SCALE PACKAGE IN A WAFER STATE

摘要

PURPOSE: A method for manufacturing a chip scale package in a wafer state is provided, which forms a metal wire and an insulating layer on a semiconductor wafer to manufacture a chip scale package. CONSTITUTION: The method for manufacturing a chip scale package in a wafer state comprises the steps of: providing a semiconductor wafer (10) having a chip cutting region between integrated circuit chips; forming a metal wire layer (66) to be electrically connected to chip pads (12); covering an insulating layer (68) having a certain thickness on an inactive layer (14) and the metal wire layer (66) and removing a part of the insulating layer (68) to form a ball pad (70); forming a solder ball (74) to the ball pad (70); and cutting the semiconductor wafer (10) to divide each integrated circuit for obtaining a chip scale package. Thereby, it is possible to decrease the manufacturing cost.