CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART

摘要

A conductive paste used for mounting an electronic part on a board or connecting electrodes, a conductive structure using the paste, an electronic part, a module, a circuit board, a method for electrical connection, a method for manufacturing a circuit board, and a method for manufacturing a ceramic electronic part (all will be refered to as "conductive paste and so forth") are disclosed. Electrical connection using conductive paste is used in various fields for its ease. The conductivity of conductive paste is ensured by the contact between conductive particles in the conductive paste. Conventionally, stress is generated in conductive paste when it is heated, and the contact between conductive particles is partially broken when the stress is relaxed, causing a problem of high resistance. The conductive paste of the invention is characterized in that it contains conductive particles, a foaming material foamable when heated or depressurized, and a resin and it does not lose its conductivity even after the foaming material is foamed. The base has a good stress resistance and enables low-resistance electrical connection.