发明名称 DIAMOND ABRASIVE PARTICLES AND METHOD FOR PREPARING THE SAME
摘要 <p>Diamond abrasive particles which are prepared from a diamond synthesized under a static extra-high pressure, have a heat-affected structure formed by a heat treatment at 1000 °C or higher, comprise a nonagglomerative aggregate of fine single diamond crystal particles having a mean particle diameter (D 50 value) of 5 νm or less, and have a diamond surface covered with 0.5 mass % relative to the whole diamond particle of a non-diamond carbon; and a method for preparing modified diamond abrasive particles, characterized in that diamond particles having a mean particle diameter (D 50 value) of 50 nm or more are heat-treated at a temperature of 1000 °C or higher in a non-oxydizing atmosphere or under vacuum so that the surface of the diamond particles are partially converted to a non-diamond carbon. The aforementioned diamond abrasive particles and a method for preparing modified diamond abrasive particles provide abrasive particles of fine single crystal type which are prepared from a diamond synthesized under a static extra-high pressure and, in spite of that, satisfy all of the following requirements for abrasive grains for use in slurry processing: (1) a large amount of a material can be processed in a unit of time, (2) the surface roughness of a processed surface is small, and (3) when a soft material is processed, the number of abrasive grains remaining on a processed surface is small, and a method of preparing such particles.</p>
申请公布号 WO2000012647(P1) 申请公布日期 2000.03.09
申请号 JP1999004684 申请日期 1999.08.30
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