Surface modification of medical implants

摘要

An irregularly etched medical implant device is provided having random non-uniform relief patterns on the surface ranging from about 0.3 mu m to less than about 20 mu m in depth. The random, irregular surface as defined by the etch micromorphology and respective dimensional properties are obtained by exposing a surface to a reactive plasma in a chamber wherein said reactive plasma produces a reaction product with the surface to thereby etch the surface, said reaction product or a complex thereof having a vapor pressure lower than a pressure in the chamber; providing a dynamic masking agent during the etching process; and removing the reaction products.